Satish, Hemanth: search on Z-Library

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1

Bioactive and Biocompatible Nature of Green Synthesized Zinc Oxide Nanoparticles from Simarouba glauca DC.: An Endemic Plant to Western Ghats, India

Hemanth Kumar, N. K., Murali, M., Satish, A., Brijesh Singh, S., Gowtham, H. G., Mahesh, H. M., Lakshmeesha, T. R., Amruthesh, K. N., Jagannath, Shobha

Journal:

Journal of Cluster Science

Year:

2019

Language:

english

File:

PDF, 2.80 MB

english, 2019

2

A REVIEW OF MINING TECHNOLOGIES FOR SPACE

Satish, Hemanth, Radziszewski, Peter, Ouellet, Jacques

Journal:

Proceedings of the Canadian Engineering Education Association

Year:

2011

File:

PDF, 67 KB

2011

3

Design issues and challenges in lunar/Martian mining applications

Satish, Hemanth, Radziszewski, Peter, Ouellet, Jacques

Journal:

Mining Technology

Year:

2005

Language:

english

File:

PDF, 198 KB

english, 2005

4

Potassium Periodate/NaNO 2 /KHSO 4 -Mediated Nitration of Aromatic Compounds and Kinetic Study of Nitration of Phenols in Aqueous Acetonitrile

Sriram, Y. Hemanth, Fatima, Touheeth, Rajanna, K. C., Kumar, M. Satish, Raju, R. Madhusudan

Journal:

International Journal of Chemical Kinetics

Year:

2017

Language:

english

File:

PDF, 698 KB

english, 2017

5

Nasal application of petrolatum ointment - A silent cause of exogenous lipoid pneumonia: Successfully treated with prednisolone

Kilaru, Hemanth, Prasad, Sudhir, Radha, Sistla, Nallagonda, Ravindra, Kilaru, Satish Chandra, Nandury, Eshwar Chandra

Journal:

Respiratory Medicine Case Reports

Year:

2017

Language:

english

File:

PDF, 1012 KB

english, 2017

6

Massive hemoptysis from Rasmussen's aneurysm in active pulmonary tuberculosis; A case report of successful treatment with bronchial artery embolization

Rajamannar, K.V., Kilaru, Hemanth, Aravelly, Srujana, Gudipati, Ananta Ram, Chandra Kilaru, Satish

Journal:

Respiratory Medicine Case Reports

Year:

2017

Language:

english

File:

PDF, 1.31 MB

english, 2017

7

Silica supported perchloric acid and potassium bisulphate as reusable green catalysts for nitration of aromatics under solvent free microwave conditions

Kumar, M. Satish, Sriram, Y. Hemanth, Venkateswarlu, M., Rajanna, K. C., Sudhakar, M. Sai, Venkanna, Purugula, Saiprakash, P. K.

Journal:

Synthetic Communications

Year:

2017

Language:

english

File:

PDF, 776 KB

english, 2017

8

Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications

Panigrahi, Asisa Kumar, Kumar, C. Hemanth, Bonam, Satish, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Journal:

Japanese Journal of Applied Physics

Year:

2018

Language:

english

File:

PDF, 2.04 MB

english, 2018

9

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration

Patil, Suraj, Kumar Panigrahi, Asisa, Bonam, Satish, Hemanth Kumar, C., Krishan Singh, Om, Govind Singh, Shiv

Year:

2016

Language:

english

File:

PDF, 772 KB

english, 2016

10

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications

Panigrahi, Asisa Kumar, C, Hemanth Kumar, Bonam, Satish, K, Brince Paul, Ghosh, Tamal, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

File:

PDF, 436 KB

2018

11

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding

Cheemalamarri, Hemanth Kumar, panigrahi, Asisa Kumar, Bonam, Satish, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

File:

PDF, 555 KB

2018

12

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications

Panigrahi, Asisa Kumar, C, Hemanth Kumar, Bonam, Satish, K, Brince Paul, Ghosh, Tamal, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 436 KB

english, 2018

13

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding

Cheemalamarri, Hemanth Kumar, panigrahi, Asisa Kumar, Bonam, Satish, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 555 KB

english, 2018

14

[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application

Kumar, C Hemanth, Pnaigrahi, Asisa Kumar, Paul, Nirupam, Bonam, Satish, Krishna Vanjari, Siva Rama, Singh, Shiv Govind, Panigrahi, Asisa Kumar

Year:

2018

Language:

english

File:

PDF, 2.14 MB

english, 2018

15

[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Silicide based integration approach for fabricating highly reliable, hermitically sealed on-chip, low form factor-microfluidics for 3D IC cooling applications

Kumar, C. Hemanth, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

File:

PDF, 123 KB

2018

16

Role of Xpert MTB/RIF in Bronchoalveolar lavage fluid of sputum-scarce, suspected Pulmonary TB patients

Kilaru, Satish Chandra, Chenimilla, Nagender Prasad, Syed, Umair, Momin, Kashif, Kilaru, Hemanth, Patil, Ekta, Nerurkar, Vidya

Journal:

Journal of Clinical Tuberculosis and Other Mycobacterial Diseases

Year:

2019

Language:

english

File:

PDF, 622 KB

english, 2019

17

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Gold Passivated Cu-Cu Bonding At 140°C For 3D IC Packaging And Heterogeneous Integration Applications.

Bonam, Satish, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 348 KB

english, 2018

18

Interface and reliability analysis of Au passivated Cu-Cu fine pitch thermocompression bonding for 3D IC applications

Bonam, Satish, Panigrahi, Asisa Kumar, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 1.12 MB

english, 2019

19

Microstructure and Corrosion Characteristics of In Situ Aluminum Diboride Metal Matrix Composites

Dayanand, Samuel, Boppana, Satish Babu, Hemanth, Joel, Telagu, Aravinda

Journal:

Journal of Bio- and Tribo-Corrosion

Year:

2019

Language:

english

File:

PDF, 1.94 MB

english, 2019

20

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - High Density metal alloy Interconnections Using Novel Wafer Bonding Approach For 3D IC Packaging Applications

Kumar, C Hemanth, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2018

Language:

english

File:

PDF, 331 KB

english, 2018

21

Active pulmonary tuberculosis presenting with acute respiratory failure

Kilaru, Satish Chandra, Prasad, Sudhir, Kilaru, Hemanth, Anneela, Raghavender Reddy, Hasan, Ashfaq, Nandury, Eshwar Chandra

Journal:

Respirology Case Reports

Year:

2019

Language:

english

File:

PDF, 2.55 MB

english, 2019

22

Focal organizing pneumonia simulating lung malignancy: treated with prednisolone

Kilaru, Hemanth, Jalna, Mohd Vaseem, Kilaru, Satish Chandra, Nandury, Eshwar Chandra, Khan, Mohammed Zia Ur Rehman

Journal:

Respirology Case Reports

Year:

2019

Language:

english

File:

PDF, 26.57 MB

english, 2019

23

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Achieving of aluminumâaluminum wafer bonding at low temperature and pressure using Surface passivated technique

Bonam, Satish, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2019

Language:

english

File:

PDF, 4.64 MB

english, 2019

24

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Interface Analysis of High Reliable Hermitic Sealed Microfluidic Channels for Thermal Cooling in 3D ICs

Cheemalamarri, Hemanth Kumar, Bonam, Satish, Banik, Dhiman, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Year:

2019

Language:

english

File:

PDF, 3.28 MB

english, 2019

25

Mechanical and micro structural properties of concrete subjected to elevated temperature

Pallapu, Venkata Sairam, Satish, B.J.N., Reddy, Komma Hemanth Kumar

Journal:

Materials Today: Proceedings

Year:

2020

File:

PDF, 2.37 MB

2020

26

Ti/Si interface enabling CMOS compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D IC integration

Cheemalamarri, Hemanth Kumar, Bonam, Satish, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

Journal:

Journal of Micromechanics and Microengineering

Year:

2020

File:

PDF, 1.84 MB

2020

27

Tuberculous mediastinal lymphadenopathy presenting with left vocal cord palsy: A rare entity

Vinatha, Kodam, Pradeep Kumar, Dasari, Ramesh, Vardhelly, Nagender Prasad, Chenimilla, Madire, Ramulu, Kilaru, Hemanth, Sudeep, Madisetty, Venkata Nagarjuna, Maturu, Kilaru, Satish Chandra

Journal:

Indian Journal of Tuberculosis

Year:

2020

File:

PDF, 992 KB

2020

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